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MMIC在T/R组件中的应用 被引量:5

Application of MMIC for T/R Module
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摘要 采用单片微波集成电路(MMIC)芯片技术和多芯片组件(MCM)微组装工艺,设计了一款小尺寸双通道发射接收(T/R)组件。组件由环形器、限幅器芯片、低噪声放大器(LNA)芯片、幅相控制多功能芯片、驱动放大器芯片和功率放大器芯片(PA)等部分构成。基于Ga As的LNA MMIC芯片具有更低噪声系数,基于Ga N的PA MMIC芯片具有更高的输出功率及功率附加效率。组件接收通道采用基于Ga As的LNA芯片,发射通道采用基于Ga N的PA芯片,设计了针对发射通道驱动放大器与功率放大器的协同脉冲调制电路。研制的T/R组件在8~12 GHz的频带内:接收通道在工作电压+5 V连续波的条件下,小信号增益大于20 d B,噪声小于3 d B;发射通道在周期1 ms,脉宽10%的调制脉冲条件下,脉冲发射功率大于46 d Bm。T/R组件外形尺寸为70 mm×46 mm×15 mm。 Based on monolithic microwave integrated circuit( MMIC) technology and multichip module( MCM) packing technics, a kind of the miniaturized T/R module with two channels was presented. The module is composed of the circulator,limiter chip,low noise amplifier( LNA),amplitude and phase control multifunction chip,drive amplifier chip,power amplifier( PA). The low noise amplifier based on Ga As MMIC technology has lower nosie figure,the power amplifier based on Ga N MMIC has higher output power and higher power added efficiency. Therefore, the T/R module uses Ga As LNAs in the receiver channel and Ga N PAs in the transmitter channel. A high voltage pulse modulate circuit was designed for the drive amplifier and power amplifier. Within the bandwidth of the 8-12 GHz,the results show that the gain of the receiver channel is larger than 20 d B,the noise figure is lower than 3 d B under the +5 V continue wave condition. The output of the transmitter channel power is more than 46 d Bm under the pulse wave condition( period is 1 ms,pulse duration ratio is 10%). The size of the T/R module is 70 mm×46 mm×15 mm.
出处 《半导体技术》 CAS CSCD 北大核心 2015年第11期810-814,共5页 Semiconductor Technology
关键词 单片微波集成电路(MMIC) 多芯片组件(MCM) 氮化镓 砷化镓 发射接收(T/R)组件 monolithic microwave integrated circuit(MMIC) multichip module(MCM) GaN GaAs transmitter/receiver(T/R) module
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参考文献9

  • 1赵正平.固态微波毫米波、太赫兹器件与电路的新进展(续)[J].半导体技术,2012,37(1):1-8. 被引量:4
  • 2BETTIDI A, CETRONIO A, CICOLANI M, et al. X- band T/R module in state-of-the-art GaN technology [C] /// Proceedings of European Radar Conference. Rome, Italy, 2009: 258-261.
  • 3SATOSHI M, MASAO Y, OHKI T, et al. C-Ku band GaN MMIC T/R frontend module using muhilayer ceramics technology [ C ] //Proceedings of IEEE Inter- national Microwave Symposium Digest. Baltimore, MD, USA, 2011: 1-4.
  • 4HARRIS M, HOWARD R, WALLANCE T. GaN-based components for transmit/receive modules in active elec- tronically scanned arrays [ C ] // Proceedings of CS MANTECH Conference. NEW Orleans, Louisiana, USA, 2013: 99-101.
  • 5POZAR M D. Microwave Engineering [ M ]. 3rd ed. USA: John Wiley & Sons, Ltd, 2005: 419-426.
  • 6ZHU J, ZHOU Z P, SHI H N, et al. X-band T/R module based on GaN MMICs power amplifier [ C] // Proceedings of International Asian and Pacific Conference on Synthetic Aperture Radar. Seoul, Korea, 2011: 1-4.
  • 7崔玉兴,王民娟,付兴昌,马杰,倪涛,蔡树军.高效率X波段GaN MMIC功率放大器的研制[J].半导体技术,2012,37(7):513-516. 被引量:2
  • 8吴家锋,湛振华.基于GaN HEMT器件的P波段小型化40W发射模块[J].半导体技术,2015,40(1):34-38. 被引量:2
  • 9DUNSMORE J P. Handbook ofmicrowave component measurements with advanced VNA techniques [ M ]. USA: John Wiley & Sons, Ltd, 2012: 249-322.

二级参考文献85

  • 1郑新.三代半导体功率器件的特点与应用分析[J].现代雷达,2008,30(7):10-17. 被引量:29
  • 2孙再吉.IMEC研制大尺寸氮化物外延片[J].半导体信息,2009(2):15-16. 被引量:2
  • 3张光义,王炳如.对有源相控阵雷达的一些新要求与宽禁带半导体器件的应用[J].现代雷达,2005,27(2):1-4. 被引量:23
  • 4王同祥,武继斌,张务永.X波段功率单片放大器的研制[J].半导体技术,2005,30(12):60-62. 被引量:2
  • 5毕克允,李松法.宽禁带半导体器件的发展[J].中国电子科学研究院学报,2006,1(1):6-10. 被引量:22
  • 6EMAMI S, WISER R F, ALI E, et al. A 60 GHz CMOS phased-array transceiver pair for multi-Gb/s wireless communications [ C ]//Proceedings of the IEEE International Solid-State Circuits Conference. San Francisco, CA, USA, 2011:164 - 165.
  • 7DEFERM N, REYNAERT P. A 120 GHz 10 Gb/s phase-modulating transmitter in 65 nm LP CMOS [ C] // Proceedings of the IEEE International Solid-State Circuits Conference. San Francisco, CA, USA, 2011: 590-292.
  • 8MOMENI O, AFSHARI E. A 220-to-275 GHz traveling- wave frequency doubler with -6.6 dBm power at 244 GHz in 65nm CMOS [ C]// Proceedings of the IEEE International Solid-State Circuits Conference. San Francisco, CA, USA, 2011:286 -288.
  • 9SEOKE Y, CAO C H, SHIM D H, et al. A 410GHz CMOS push-push oscillator with an on-chip patch antenna [C]// Proceedings of the IEEE International Solid-State Circuits Conference. San Francisco, CA, USA, 2008: 472 - 473.
  • 10HUANG D, LAROCCA T R, SAMOSKA L, et al. 324 GHz CMOS frequency generator using linear superposition technique [ C] //Proceedings of the IEEE International Solid-State Circuits Conference. San Francisco, CA, USA, 2008 : 476 -477.

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