激光刻蚀制备微波介质陶瓷滤波器工艺研究

Researchon Microwave Dielectric Ceramic Filter by Laser Etching Technology

采用激光在微波介质陶瓷滤波器的镍、铜、银的镀层表面刻蚀制备耦合电容图形。分别研究了激光刻蚀功率、激光刻蚀速度对图形微槽深度、产品合格率和产品二次污染率的影响。结果表明,在激光刻蚀速度一定时,耦合电容图形微槽的深度、产品的二次污染率随激光刻蚀功率先增大后减小,激光刻蚀功率为15 W时达到最大值;在激光刻蚀功率一定时,耦合电容图形微槽的深度、产品的二次污染率随激光刻蚀速度的增大而减小。产品合格率在激光刻蚀速度一定时,激光刻蚀功率达到13 W以后保持在95%以上;在激光刻蚀功率一定时,激光刻蚀速度达到1 000mm/min以前保持在95%以上。因此最佳的激光刻蚀参数为:刻蚀速度为800mm/min,刻蚀功率为18 W。

A microwave coupling capacitance is etched by using of laser on copper, silver Nickel-plated surface for fabricating dielectric ceramic filters. The relationship between groove size, qualified product rates and secondary pollution rate were studied at the different laser power and scanning speed. Results show that both the groove depth and secondary pollution rate firstly increase and then decrease with laser power enhancement. The optimal value is found at the laser power of 15W. The groove depth and secondary pollution rate is declined with scanning speeds at a constant laser power. Qualified products rate maintain 95% after laser power reaching 13 W at a constant laser speed. Also, the qualified product rate is kept at 95% before laser scanning speeds is lower than 1 000 mm/min, then a sharp decline is found as the scanning speeds increases. Finally, an optimal laser parameters is obtained at the scanning speeds of 800 mm/min and the laser power of 18 W.