热处理过程中集成电路用弥散颗粒增强铜合金的变形行为研究

Study on Deformation Behavior of Particle Reinforced Copper Alloy During Heat Treatment

采用真空氧化压制法制备集成电路用弥散颗粒增强铜合金,研究其硬度和微观组织,并利用热模拟机对其变形行为进行研究和分析。结果表明,弥散颗粒增强铜合金的硬度可达到161 HV。变形温度为600~950℃,变形速度为0.001~1.000 s-1条件下,该铜合金的应力随着应变的增大呈现先增大后减小的趋势,最后趋于稳定值。

The particle reinforced copper alloy was prepared by a vacuum suppress oxidation method,and the hardness,microstructure and deformation behavior during heat treatment were studied.The results show that the hardness of particle reinforced copper alloy is 161 HV.The stress increases first and then decrease with the increase of strain,and finally tends stable,when the deformation temperature and deformation rate are 600~950 ℃ and 0.001~1.000 s-1,respectively.