图电产品、超粗化与干膜匹配参数分析研究

Study on graphics compensation in acid etching

文章采用微观电子分析方法，对不同特性干膜及对应的前处理超粗化微蚀药水对铜面咬蚀程度进行比较，结合两者的特点作针对性的分析，通过实验验证，从而找到图电工艺产品在前处理使用超粗化时线条边缘点状渗镀的根因，为实际生产中出现线条及大铜面边缘点状渗镀导致的线边不齐提供改善的方向。

In this paper, we take the electron microscopic analysis method, the characteristics of different dry film and the corresponding pretreatment super roughening micro etching drops on the copper surface bite inhibition degree were compared, combined with the characteristics of both made for analysis and verified by experiments, So as to find the basic reason of the edge point of the edge of the graphic plating process product line when we use super coarsening in Pre-treatment, for actual production appear lines and large copper surface edge punctate infiltration plating uneven edges provide improvement direction.