快速填盲孔电镀铜添加剂的研究

Research on rapid copper electroplating additives for blind via

介绍了—种快速填盲孔电镀铜工艺，镀液的基本墨目成和工艺条件是：CuSO4·5H3O 210g／L，H2SO4 85g／L，Cl-50ng／L，湿润剂C（环氧乙烷与环氧丙烷缩聚物）（5-30）ml／L，整平剂L（含酰胺的杂环化合物）（3～16）ml／L，加速剂B（苯基聚二硫丙烷磺酸钠）（0．5-3）ml／L，温度23℃，电流密度1．6A／dm2，阴极摇摆15回／min或空气搅拌。研究了湿润剂C，整平剂L和加速剂B对盲孔填孔效果的影响，结果表明湿润剂C与加速剂B用量对填孔效果影响较大，而整平剂L影响较小。加入适量的该添加剂体系到基础镀液中，常规的HDI盲孔（孔径100μm～125μm，介质厚度75um）在表面镀层厚度12μm-15μm时，可以实现填孔率大于95％，得到铜镀层的延展性和可靠性满足印制电路板技术要求。此外，本研究测定了该添加剂体系填孔过程，明确其药水爆发期在起镀的（15～20）min，而且爆发期期间孔内的沉积速度是表面的至少11倍。

This paper introduced a rapid copper plating process for the blind via.The basic composition and process conditions are as follows： CuSO4.5H20210 g/L, H2SO485 g/L, CF 50 mg/L, wetting agent C （epoxy ethane and epoxy propane polycondensate） from 5 to 30 ml/L, leveling agent L （heterocyclic compounds containing amide） from 3 to 16 ml/L, accelerator B （phenyl polydipropyl sulfonate） from 0.5 to 3 ml/L, 23 ~C, current density 1.6 A/dm2, cathode swing 15 times/min or air agitation. The influences of wetting agent C, leveling agent L and accelerator B on blind via filling were studied. The results indicated that the dosages of wetting agent C and accelerator B have a great effect on blind via filling, while leveling agent L has a slight, effect on it. Being added with a suitable amount of the said additive system to the basic plating bath, the blind via of conventional HDI （aperture 100 - 125μm, medium thickness 75μm）can be achieved a filling ratio higher than 95% while the coating thickness of the surface is from 12 to 15μm. The ductility and reliability of the copper coating obtained can meet the technical requirements of printed circuit boards.In addition, the research measured via filling process with the additive system, and confirmed that the outbreak of the plating bath be gined after plating from 15 to 20min. It was at least 11 times that the deposition rate on the via was faster than that on the surface during the outbreak.