摘要
本文通过对比不同的余胶表面处理方式,得到了一些初步结论,并根据这些结论针对余胶表面粗糙度的研究,初步锁定了台阶槽壁沉铜不上的原因。通过对等离子去钻污及药水去钻污的去钻污量及粗糙度的研究,输出了稳定加工台阶板的方法,得到了稳定的加工品质。
The surface through comparing the different residual glue, some preliminary conclusions, and according to these conclusions for residual glue surface roughness is studied, initially locked step groove wall copper deposition on the reason. Through the research on the pollution and the roughness of the plasma, the method of stabilizing the step plate is output.
出处
《印制电路信息》
2015年第A01期184-191,共8页
Printed Circuit Information
关键词
台阶板
沉铜
余胶
粗糙度
Step Plate
Electroless Copper
Residual Adhesive
Roughness