高密度无引线印制插头的加工推广

The process on the high density none-conductive wire gold finger-plating

部分线路板需要与进行物理性的插接，为了保证连接的可靠性，采用电镀镍金的方式将板件镀上镍金。当有小间距Pad的时候，采用蚀刻出镀金引线的方式加工。但是有部分PAD无法拉出工艺引线时，就采用贴干膜露出镀金区进行镀金。由于干膜耐电镀金的电流差，当PAD的间距较小时，如〈0．075nm时，药水会渗入干膜，导致PAD连在一起。上述目前业内镀镍金的板的加工方法具体有：（1）采用蚀刻后拉工艺引线电镀镍金：通过贴干膜曝光、蚀刻的方式，蚀刻出需要镀金的PAD以及连接PAD的镀金导电用的导线。然后通过导线接通电流镀金（对导线通电，放在镀缸中电镀）。其优点是可以做小间距PAD的镀镍金板；缺点是针对PAD在板内无法拉镀金工艺引线的板就无法加工；（2）采用贴保护干膜后电镀镍金：其优点是可以做无板内无法拉镀镍金工艺引线的板；缺点是PAD之间距离小时，药水易渗入干膜下，导致短路，产品良率极低。新的方法采用耐电镀防焊油墨抗镀的方法，对比测试了防焊镀对镀金的可靠性的影响，解决了小距离镀金．PAD之间距离的渗镀问题。

Part of the circuit board need physical inserted in order to ensure the reliability of the connection, need using nickel gold plating way plate nickel plated gold. When there is a small spacing of Pad, a gold plated lead the way by etching processing. But some PAD can＇t pull out process leads, on the use of paste dry film exposed area is plated with gold gilt. Because the potion of dry film resistance of gold plating electricity is poor, when the PAD spacing is small, such as 〈 3mil, potion will seep into the dry film, leading the PAD together by gold solution. The present method for processing industry nickel gold plate as follows 1. After the etching process using gold plating pull wire： through the dry film lamination exposure, etching method, etching gold plated PAD and conductive wire connecting the PAD to plating gold. And then electroplate the gold through the wire connected to the gold. The advantage is can do small spacing of gold plate PAD; the disadvantage is unable to processed the PCB which can not pull the conductive wire. 2. using the dry film to plating gold： the advantage can do the PCB unable to pull the wire to plate gold; the disadvantage is distance between PAD is small, potion easy to permeate into the dry film, causing a short circuit between two pads, the product yield is very low. New methods using solder resist ink anti plating, tested the sold mask effect on gold PAD＇s reliability, solves the small distance PAD gold plating problems.