关于刚挠结合板ICD问题的研究与改善

Research and improvement of the ICD for Rigid-Flex PCB

刚挠结合板同时具备FPC与PCB的特点——轻且薄，挠曲配线，可缩小体积且减轻重量，在电子及通讯行业得到日趋广泛的应用和重视。究其材料特点在加工中存在很多问题，特别是ICD（内层互连不良）、孔粗、内层孔壁分离等不良问题，严重影响产品可靠性。文章通过采用正交实验设计进行测试，有效地解决了软硬结合板此类问题，并提供了DOE实验方法用于复杂问题的实验设计。

Rigid-flex Board, has the characteristic of FPC and PCB which is light and thin,flexible and can match wires, can reduce volume and lighten weight, is widely used in the electronic and communication industry. Because of the special properties,this material has a lot of problems in the manufacturing process,especially ICD（the inner micro circuit bearer）, nail head,the inner hole wall separation and other undesirable phenomena,which of these problem affect the products＇ reliability severely. In this paper, by using the DOE test optimization,which solve such these problem of the rigid-flex board efficiently, and provide the experiment method of DOE for experiment designing of complex question.