带印制插头刚挠结合板工艺优化探讨

Research on the optimization of Rigid-Flex PCB with gold finger technology

随着刚挠结合板产品可靠性需求的日益提升，产品成型精度的不断增加，带印制插头刚挠结合板在传统制作工艺中出现印制插头电测难、成型偏移已经不是一个可以忽略的工艺问题，导致产品的电气性能难保证，印制插头外形精度不能满足客户的要求，产品良率低，增加制作成本。文章通过对带印制插头刚挠结合板电测、成型工艺流程进行优化，有效改善产品印制插头电测难、成型偏移的问题，满足客户产品需求。

Along with the increasing reliability and accuracy demand of Rigid-flex PCB products, it is hard to ignore the problems of gold finger eleetrical test difficulty and offset of the Rigid-flex PCB with gold finger. So that it is difficult to guarantee the product electrical performance and unable to meet customer＇s requirements of finger shape accuracy, which ultimately results in low qualification rate and high manufacturing costs. This paper explores the way which can effectively improve the difficulty of gold finger electrical test and offset, and meet customer＇s demand by optimizing the electrical test and molding process of Rigid-flex PCB with gold finger.