FPC键合工艺技术改善研究

The study of improving the COB technology about FPC

随着降低成本及高端传输的需求，COB（Chip on Board，载芯片板）技术越来越受到PCB用户的欢迎，但COB技术对PCB产品的金面质量、洁净度及镀层厚度都有着诸多苛刻要求。文章针对FPC产品本身材质特性及加工工艺特性，探讨了挠性基材、补强压合工艺及激光外形工艺对COB性能的影响，总结出柔性基材承受能力及金面污染是影响FPC产品COB性能的主要因素，并在此基础上提出通过建立FPc选材规则、优化补强压合工艺及激光外形后处理等改善措施，从而提高FPC产品的COB性能。

COB （chip on board） technology was welcomed more and more by PCB users, with the requirements about reducing costs and the transmission of high-end, but many of the strict requirements of the quality, cleanliness and the thickness of the coating in the gold surface about PCB products, was required by COB technology, The influence brought to the performance of COB by the flexible substrate, the process of lamination about reinforcement and laser shape was discussed in this article, according to the characteristics of the properties of material and processing about FPC products, the conclusion is that the main factors that influence the COB performance about FPC were the tolerance capacity of flexible substrate and the gold surface contaminants. Base on this, the improvement measures by setting up the rules of material selection about FPC, optimizing the process of lamination about reinforcement and after treatment of laser shape, were put forward, so the performance of COB in the FPC products was greatly improved.