阶梯印制插头PCB一次压合工艺开发

Research on cavity gold finger PCB with one step press process

阶梯槽底部制作印制插头可使产品更加轻、薄，同时又不影响整板布线和功能设计，前期已成功研发出二次压合工艺实现了阶梯印制插头产品的批量生产。但该工艺存在诸多问题，如报废率较高，流程较长，生产效率低等，针对这些问题，采用一次压合工艺优化阶梯印制插头产品制作。本文阐述了新工艺对流程、层压结构的优化，并对开槽芯板棕化、层压参数、槽内印制插头制作等难点进行了分析和试验，产品可靠性符合要求，成功开发出新的一次压合阶梯印制插头工艺，提升了生产效率和产品品质。

Cavity gold finger can reduce the size of the terminal product, and the layout and functional design should not be affected. We have already developed two step press cavity GF process, and successful mass production. But the process still has many problems, such as higher rejection rate, longer procedure and the lower efficiency. So we use the one step press process to optimize the Cavity GF manufacturing. The procedure and laminated structure optimization of the new process were detailed introduced. The manufacturing difficulties of the new process such as thin core BR, lamination parameter optimization, and cavity GF forming etc. were analyzed and tested also. The reliability of products can meet the requirement. The successful development of the one step press process cavity gold finger PCB technology can improve production efficiency and product quality.