适用于高频信号传输HDI板的塞孔树脂的研制

Development of plugging resin used in high-frequency radio HDI board

文章通过选取不同特性的环氧树脂进行科学的复配以及合理地使用固化剂组使得BTH-8000系列塞孔树脂具有较高的耐热性，固化物殆值高达176℃（TMA法）。研究结果表明，纳米添加剂的使用大大提高了BTH-8000系列塞孔树脂的触变性，对升温固化程序适应性更强，彻底杜绝了塞孔过程中的渗墨现象。BTH-8000系列塞孔树脂的电性能评测表明，其介电常数远低于目前市场中使用的塞孔树脂产品以及行业标准，达到3．65，且损耗因子仅为0．0089。体积电阻率高达1．03×1016Ω·cm，大大高于目前市场中使用的塞孔树脂产品。塞孔应用试验证实，塞孔饱满无收缩，与铜结合良好。所以，BTH-8000系列塞孔树脂的性能完全达到了国际先进水平，可以替代进口产品的使用，降低企业的生产成本。

It makes BTH-8000 series plugging resin as high heat resistance as well as Tg values up to 176~C （TMA） that the coordination of different characteristic epoxy resins and application of suitable curing agent group were scientifically used. The study indicates that the use of nano additive can greatly improve the thixotropic property of the BTH-8000 series plugging resins, and meanwhile the plugging resin overflow phenomenon is completely eliminated. The electrical performance testing for BTH-8000 series plugging resins shows that the dielectric permittivity is only 3.65 and the dielectric loss value is 0.0089 which is lower far than that of the products used in the present market and the industry standards. Volume resistivity reaches to 1.03x 1016 .cm, which is also much higher than the currently products used in the market. Via hole filling application test confirms that the cured resin has no shrinkage and good combination with the copper layer. Therefore, BTH-8000 series plugging resin performance is as good as that of those international advanced products to replace the imported products absolutely. Thus, the production costs can be reduced for the enterprises.