高频多阶高密度互连板制作技术研究

Research on the production method of high frequency and density interconnection PCB

电子通讯产品的高频化、高可靠性的要求，对材料及加工方提出了一定挑战。结合当今的电子产品发展方向，本文以一款4阶叠~LHDI、高频板材PCB为例，概述其制作难点，并就问题点提出改善方法。

Requirements for high frequency and reliability of electronic communication products, put forward a challenge on the raw materials, processing side. Combination of current electronic product development direction, this paper takes a 4 steps stacked up HDI high frequency PCB as an example, takes an overview of its production difficulties, and put forward improving methods on the problem.