一种HDI导热材料厚铜板制作技术探讨

A thick copper production technology of HDI thermal conductive materials

电源设备，高电流一般用到PCB要具备良好的散热性，但高密度互连特性也逐步出现在多功能电源模块PcB中，高密度互连设计务必会牺牲PcB一部分散热性能，所以其所有材料的导热性及铜厚都比较高，随着电子产品越来越高端化，而电源设备反而是小型化，多功能化发展，高密度HDI设计相结合的组合型电源PCB产品，在这种趋势的发展下给PCB制造商带来了新的市场前景，同时也带来了技术挑战。本文着重研究一款利用导热材料（二氧化硅）厚铜制作12层HDI板，包括制作导热厚铜HDI的方法及在产品加工过程中出现的问题并提出解决的方法。

Power equipment, high current commonly used PCB have good heat dissipation. But high density interconnect characteristics have gradually appeared in the multifunctional power supply module PCB, high density interconnect design will sacrifice part of the PCB heat radiating performance. So all the materials thermal conductivity and copper thickness are relatively high, with more and more high-end of the electronic products, and power supply equipment anti but miniaturization, multi-functional development, HDI design combined with the high density of combined power supply PCB products, in the development of this trend to PCB manufacturers brought new market prospects, technical challenges as well. This paper focuses on the research of use of heat conducting material （SiO2） thick copper production 12 layer HDI board, including making heat conduction copper thickness of HDI method and the production process problem appeared and puts forward solutions.