摘要
文章对所制备的高频电路用无轮廓铜箔，进行了表面微细粗化处理。详细分析了处理后铜箔的表面粗糙度、抗剥离强度、表面微细结构以及耐热性和耐腐蚀性等综合性能特征，试验结果表明在表面粗糙度、抗剥离强度和耐热性方面，均达到了高频印制电路的特性要求，其他性能满足了多层印制电路板的使用要求。
In this paper, the surface treatment process of copper foil used in high frequency printed circuit was studied. Surface roughness, anti-peel strength, surface mircrostructure, thermal stability and corrosion resistance were analyzed in detail. Experimental results show that the property of surface roughness, anti-peel strength and thermal stability meets the performance requirement of high-frequency printed circuit copper foil.
出处
《印制电路信息》
2015年第A01期392-398,共7页
Printed Circuit Information
关键词
铜箔
表面处理
高频
覆铜板
Copper Foil
Surface Treatment
High-Frequency
Copper Clad Laminate
