全湿式薄膜金属化的二层挠性覆铜板工艺及其微细线路应用技术

All wet production process of metalized adhesiveless FCCL and its application on fine pattern circuits

与既有的挠性覆铜板（又称聚酰亚胺软性铜箔积层板）制造工艺相比较，本文论述的最新的全湿式薄膜金属化工艺，具有金属与聚酰亚胺薄膜（Polyimide略称PI）结合平滑．利于微细线路的形成，成本低，热负荷之后仍保持比较高的剥离强度的特点。同时，它能够对各种聚酰亚胺薄膜进行金属化，适用于卷对眷（Roll to Roll）的自动搬送的自动化生产设备。

Different from the conventional production process of flexible CCL（polyimide flexible CCL）, this paper provides an all-wet production process featuring smooth adhesion between metallization layer and polyimide, facile formation performance of fine patterns, low cost, and high adhesion after thermal annealing. Meanwhile, this process can perform ammonification for various kinds of polyimide and is applicable to roll to roll automatic production equipment.