摘要
SOT23产品的测试,采用压测的方式,在测试过程中电路的管脚与测试片的force、sense接触会出现一个问题。如果要获得良好的接触,施加在电路上的压力就必须加大,就会造成产品管脚变形,使产品卡在两片测试片之间,造成后续产品误测叠料。文章通过观察测试过程叠料产生的原因,对测试片进行了改进,从而有效的避免了测试过程中叠料问题的发生。
SOT23 IC adopts pressure test way to test, the IC feet contact with force and sense of contact finger, But there will be a problem in the test process, If we want to obtain the good contact, the pressure must be increased applied on the IC, this will cause deformation of IC feet, the IC package will be stuck in between two pieces of finger, And make the next IC get wrong measurment. Through the observation of test process and obtain the root cause of superposition, We improve contact finger to avoided superposition in the testing process.
出处
《中国集成电路》
2015年第11期79-81,共3页
China lntegrated Circuit
关键词
SOT23
压测
测试片
叠料
SOT23
pressure test way
contact finger
superposition
