基于CT图像重构模型的MEMS结构尺寸检测方法

Dimension Measurement of MEMS Structure Based on CT Image Reconstructed Model

微机电系统(MEMS)结构尺寸检测技术已成为其设计和加工生产的重要保证手段,但现有技术都是对MEMS表面结构进行二维测量,不能准确反应其三维形貌.对此,提出了一种基于CT图像进行模型重构的MEMS结构尺寸检测方法.该方法通过CT扫描的断层图像建立MEMS结构的三维模型,然后通过特征点提取、边缘检测和特征区域划分识别出结构的几何特征区域,然后用最小二乘法对提取的特征数据进行拟合,提取其基本参数信息,最后计算MEMS结构关键几何参数,并提出了一种微结构表面质量参数的计算方法.该方法摆脱了传统方法对三维结构的检测限制,可实现MEMS结构的三维检测.

Dimension measurement technology of micro-electro-mechanical system （ MEMS） structure is an important way of guaranteeing the design and production.Present detection techniques of MEMS sur-face texture are two-dimensional, which cannot demonstrate the three-dimensional MEMS structures accu-rately.Regarding this, a new dimension measurement method of MEMS structure based on CT image is proposed.First, the three-dimensional model of MEMS was reconstructed based on CT images.Then the geometric feature regions of the structure were recognized by feature point extraction, edge detection and region feature classification.Next, the extracted feature data was fitted using least square method and its basic parameter information was obtained.Finally, the key geometric parameters of MEMS structure were calculated and a calculation method of microstructure surface quality parameters was proposed.This method overcomes the traditional detection limitation and realizes three-dimensional detection of MEMS structure.