摘要
以有机硅改性环氧树脂和改性胺类固化剂制备了耐瞬时高温柔性环氧胶黏剂。对合成的有机硅改性环氧树脂进行了FT-IR分析,并对胶黏剂的固化行为进行了DSC分析。结果表明:有机硅链段成功的引入到环氧树脂中,制得的胶黏剂起始固化温度在71℃左右,固化放热峰对应107.7℃。胶黏剂具有较好的柔性和粘接性能,断裂伸长率为67.2%,剥离强度为10.2k N/m。其耐热性能优于未改性的环氧树脂胶黏剂,700℃残重为5.1%,可耐350℃瞬时高温,并且具有较好的耐老化性能。
The instantaneous heat resistance flexible epoxy adhesive was prepared with organic silicone modified epoxy and modilied amine cur- ing agent. The structure and curing behavior of organic silicone modified epoxy resin was analyzed by FT-IR and DSC respectively. The results showed that the organic silicone segment was introduced into epoxy resin successfully. The initial curing temperatm~ of this adhesive was 71 ~C, and the curing exothermic peak was 107.7~C. The adhesive had good flexibility and bonding properties. Its elongation at bleak was 67.2%, and the 90° peel strength was 10.2kN/m. It also had better heat resisting property and aging property than the unmodified one. It could work at instantaneous hi,h-temperature such as 350℃/Stain, the residual of adhesive at 700℃ was 5.1%.
出处
《化学与粘合》
CAS
2015年第6期412-414,共3页
Chemistry and Adhesion
关键词
柔性
耐瞬时高温
环氧胶黏剂
粘接性能
力学性能
Flexibility
instantaneous heat resistance
epoxy adhesive
bonding properties
mechanical properties
