添加剂质量浓度对电镀金刚石切割线电镀形貌的影响

Influence of additive concentration on coating morphology of electroplated diamond wire

通过电镀实验，研究了在硫酸镍镀镍液中，添加剂浓度对电镀金刚石切割线电镀形貌的影响。以线径0．115 mm 的镀铜高碳钢线为基线，使用经化学镀镍磷合金增重30％、粒度尺寸为8～16μm 的金刚石微粉进行上砂。实验使用的添加剂的质量浓度为0～400 mg ／L 。研究表明：随着镀液中添加剂浓度的增加，切割线表面的金刚石的团聚现象逐渐降低。添加剂浓度较低时，对切割线表面的金刚石颗粒团聚的影响不明显，但当添加剂浓度过高时，会造成上砂困难，上砂量明显降低。本实验条件下，在满足上砂量要求的情况下，添加剂的最佳质量浓度为200～300 mg／L 。

Effect of additive concentration on electroplated morphology of diamond wire was studied through experiments . The baseline was a copper‐coated high‐carbon steel wire with its diameter of 0 .115 mm . Particle size of diamond was 8 — 16 μm , surface of which was chemically plated with nickel phosphorus alloy with a weight increase of 30% . Additive concentration ranging from 0 to 400 mg/ L . It was showed that with the increase of additive concentration , diamond gradually stopped reunion on wire surface . When the additive concentration was lower , its effect on diamond reunion was not obvious . But when the additive concentration was too high , it would make sanding difficult , thus the amount of sand significantly reduced . Under the condition of this experiment , in order to meet the certain amount of sand , the optimum concentration of additive was 200 — 300 mg/ L .