摘要
综述介绍了绝缘导热塑料与非绝缘导热塑料的发展现状,概括了目前主要应用的填料与树脂,分析了导热机理与导热率的影响因素,指出了亟待解决的问题与发展方向。
Development of thermal insulation plastic and non thermal insulation plastic was summarized. Fillers and resins widely used were expounded. Heat conduction mechanism and factors affecting the thermal conductivity were analyzed. Problems to be solved and development direction were pointed out.
出处
《广东化工》
CAS
2015年第21期114-115,共2页
Guangdong Chemical Industry
关键词
导热塑料
导热率
导热机理
导热填料
conductive plastic
heat conductivity: heat conduction mechanism
conductive fillers