摘要
设计了一种应用于光电器件的多梯度烧结、多次清洗的微组装工艺。采用共晶焊将各芯片、元器件烧结到基板上,再将基板烧结到相应管腔内。同时,通过压焊工艺进行芯片与厚膜电路导带的互联。设计了相关工艺步骤,论证了多次烧结、清洗对压焊效果的影响。实验数据表明,采用所设计的工艺制作的样品在经历多次烧结、清洗步骤后,在压焊方面具有高的可靠性,为器件的后续制作奠定了良好的基础。
A micro-packaging technology was designed for photoelectric devices for multigradient sintering and repeatedly cleaning.The eutectic welding process was used to make sintering for each chip and component,and then ceramic wafer was sintered to the corresponding pipe.Using the bonding process,chips were connected to the conduction band of the thick-film circuit.The effects of sintering and cleaning on the pressure welding were demonstrated.And experimental results verify the samples fabricated with the designed technology can obtain high bonding reliability.
出处
《半导体光电》
CAS
北大核心
2015年第5期746-749,752,共5页
Semiconductor Optoelectronics
关键词
光电器件
微组装
共晶焊
助焊剂清洗
压焊
optoelectronic devices
micro-package
eutectic bonding
scaling powder cleaning
pressure welding
