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TFT栅极绝缘层和非晶硅膜层的ITO污染对电学特性影响的研究 被引量:1

Influence of ITO contamination of TFT gate insulation & a-Si layers on electrical characteristics
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摘要 本文对TFT在栅极绝缘层和非晶硅膜层沉积过程中,透明电极ITO成分对膜层的污染和TFT电学性质的影响进行分析研究。通过二次离子质谱分析和电学测试设备对样品进行分析。ITO成分会对PECVD设备、栅极绝缘层和非晶硅膜层产生污染,并会影响TFT的电学特性。建议采用独立的PECVD设备完成ITO膜层上面的栅极绝缘层和非晶硅膜层的沉积,并且对设备进行周期性清洗,可降低ITO成分的污染和提高产品的电学性能。 Indium-tin-oxide (ITO)films as transparent conductive are applied on TFT.This paper studied the influence of ITO contamination of gate insulation & a-Si layers and TFT on electrical char-acteristics.The obtained samples were characterized by secondary ion mass spectroscopy (SIMS)and electronic parameter measurement (EPM).The result shown on the gate insulation &a-Si layers had been contaminated by ITO in the PECVD equipment,and the contamination can make TFT electrical characteristics become worse.ITO concentration in process equipments plays an important role in the TFT electrical characteristics.Therefore,we suggest the gate insulation & a-Si layers should be de-posited in independent equipment and the PECVD equipment should be cleaned periodically.Thus, the ITO contamination can be reduced and TFT electrical characteristics can also be improved.
出处 《液晶与显示》 CAS CSCD 北大核心 2015年第6期930-936,共7页 Chinese Journal of Liquid Crystals and Displays
关键词 薄膜晶体管 化学气相沉积 栅极绝缘层 有源层 非晶硅膜 氧化铟锡 电学特性 TFT PECVD gate insulation layers active layers a-Si films ITO electrical characteristics
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  • 1ROSAN K. Hydrogenated amorphous-silicon image sensors [J]. IEEE Transactions on Electron Devices, 1989, 36 (12) : 2923-2927.
  • 2CARLUCCIO R, FORTUNATO G, MILNE W I. Activated hydrogen effects on the electrical stability of a-Si: H thin-film transistors [J]. Journal of Non-Crystalline Solids, 1993, 164-166: 751-754.
  • 3UCHIKOGA S, KAKINOKI M, NAKAJIMA M, et al. A back-side passivation film on a-Si: H thin film tran- sistor [J]. Journal of Applied Physics, 1994, 76(4) .. 2484-2489.
  • 4MURTHY R V R, MA Q, NATHAN A, et al. Effect of Nh~/SiH4 gas ratios of top nitride layer on stability and leakage in a-Si: H thin film transistors [J]. MRS Proceedings, 1998, 507, doi.- 10. 1557/PROC-507-73.
  • 5ANDO M, WAKAGI M, MINEMURA T. Effects of back-channel etching on the performance of a-Si: H thin-film transistors [J]. Japanese Journal of Applied Physics, 1998, 37(7A) : 3904.
  • 6YAMAKAWA S, YABUTA S, BAN A, et al. Plasma treatment effect on the off current characteristics of a - Si TFT [J]. SID Symposium Digest of Technical Papers, 1998, 29(1): 443-446.
  • 7WASHIZUKA I, YABUTA S, OKAMOTO M. Plasma treatment effect on the off current characteristics of a-Si thin film transistor [J]. Jitsumu Hyomen Gijutsu, 1999, 50(3).. 273-277.
  • 8YI C, RHEE S W, PARK S H, etal. Effect of back-channel plasma etching on the leakage current of a-Si.. H thin film transistors [J]. Japanese Journal of Applied Physics, 2000, 39(3A).. 1051-1053.
  • 9KANG S G, BAE S C, CHOI SY. The effect of back channel hydrogen plasma treatment on the electrical charac- teristics of amorphous thin film transistors [J]. Applied Physics Letters, 2000, 77(8): 1188-1190.
  • 10SERVATI P, NATHAN A. Modeling of the reverse characteristics of a-Si.. H TFTs[J]. IEEE Transactions on Electron Devices, 2002, 49(5): 812-819.

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