摘要
在盐酸-硫酸-硝酸电解质体系下,分別加入微量Cu^(2+)、Fe^(3+)、Zn^(2+)等金属离子,并采用直流方式对高纯铝箔进行电化学侵蚀,研究了改性后的电解质溶液对高纯铝箔电蚀过程的影响。结果表明:在硫酸-盐酸-硝酸电解体系中加入微量Cu^(2+)后,能够和铝发生置换反应生成铜单质沉积在铝箔表面,形成Cu-Al微电池反应,促进铝箔腐蚀,隧道孔密度增大,隧道孔长度从10μm增长到30μm,220V化成的比容提高了78%-220%;加入Fe^(3+)后,不能形成微电池反应,对铝箔腐蚀没有明显影响;加入Zn^(2+)后,能够形成Zn-Al微电池反应,促进铝箔腐蚀,但促进效果弱于加入Cu^(2+)。
The effect of Ca^2+, Fe^3+, Zn^2+ on etching process of high purity aluminum foil in H2SO4-HCl-HNO3 under DC current were studied. It is proved that, after adding Cu^2+ into electrolyte solution, a replacement reaction occurrs and copper elementary substance generates on aluminum foil. The etching process is promoted due to the formation of Cu-AI galvanic local cells, the length of tunnels is increased from 10 μm to 30 μm, and the capacitance formed at 220 V, is increased by 78%-220%; Fe^3+ has no significant effect on the corrosion reaction; after adding Zn^2+ into electrolyte solution, the etching process is promoted due to the formation of Zn-Al galvanic local cells, but the promoting effect is less significant compared with that condition adding Cu^2+.
出处
《电子元件与材料》
CAS
CSCD
2015年第12期48-52,共5页
Electronic Components And Materials
基金
江苏省科技支撑计划(工业)项目资助(No.BE2012095)
贵州大学研究生创新基金项目资助
关键词
铝箔
直流
电化学侵蚀
电解质
金属离子
高纯铝箔
aluminum foil
DC cttrrent
electrochemical etching
electrolyte
metal ion
high purity aluminum foil