摘要
介绍了电子器件散热中常用的部件,包括热管、散热器、微型风扇等,以及为满足不断提高的热流密度而出现的新型散热部件,如振荡热管、微槽道散热器等。同时,结合电子器件散热特点,总结了散热计算的一些方法。这些计算方法是进行产品热设计和热分析的重要工具。
Several components currently used for electronic devices heat dissipation have been presented, including heat pipe, heat exchanger and miniature fan, etc.. New components which are intended to meet the increasingly high heat flux, such as Pulsating Heat Pipe(PHP), heat exchanger with microchannel, etc., have been discussed. Furthermore, on the basis of the specialties of heat dissipation for electronic devices, cal-culation methods are summarized. These calculation methods provide useful tools for thermal design and thermal analysis of related products.
出处
《机电产品开发与创新》
2015年第6期42-44,共3页
Development & Innovation of Machinery & Electrical Products
基金
上海市自然科学基金资助项目(14ZR1429100)
关键词
电子器件
热设计
散热
计算方法
electronic devices
thermal design
heat dissipation
calculation methods