摘要
随着无铅焊料在电子封装中的普及,Sn-Ag-Cu系合金因其较低的熔点及较高的可靠性能等特点,目前已被公认为传统钎料的最佳替代品并取得了实际应用。润湿性是钎焊乃至微电子焊接的基础。在钎焊温度下,钎焊区域裸露在空气中,金属表面极易氧化,严重阻碍钎料的润湿性。所以焊接气氛对润湿性以及焊点可靠性的影响是显而易见的。采用Sn-3.0Ag-0.5Cu无铅焊膏在不同的焊接气氛下对BGA器件、QFP器件以及片式电阻进行回流焊。从焊点的缺陷分析、显微组织及力学性能测试等几个方面来进行比较分析,表明通过改变焊接气氛有助于改善Sn-3.0Ag-0.5Cu无铅焊点的组织和性能。
Sn-Ag-Cu series Pb-free solder is widely used to replace traditional Sn-Pb solder in electronic industry due to its lower melting point and higher reliability. During soldering, wetting of solder promotes the joining between solder and pad on PCB board. Usually the oxidation of solder at high temperature will decrease the wettability and reliability of solder joints. Three kinds of soldering atmospheres： air, nitrogen and vacuum were used during reflow soldering to study the effect of reflowing atmosphere. Ball Grid Array （BGA）, Quad Flat Package （QFP） and 0805 resistor were used as the components. After soldering, the defects in the solder joint, microstructure and mechanical properties of solder joints were studied.
出处
《电子工艺技术》
2015年第6期311-314,共4页
Electronics Process Technology
基金
江苏省自然科学基金项目(项目编号:BK2012163)
哈尔滨工业大学先进焊接与连接国家重点实验室开放课题(项目编号:AWJ-M13-10)
