航天型号产品片式器件炉后AOI检测应用研究

AOI Technology of Chip Component After Reflow Soldering for Aerospace Product

以公司航天型号产品片式器件使用AOI技术进行检测的实践为基础,通过制定检测程序进行检测,并对检测结果进行收集和整理,找出片式器件检测误报和漏报较多的缺陷模式,再针对每种缺陷逐一分析,提出解决问题的思路。为其他航天企业AOI设备高效使用提供了基础,为AOI技术在航天产品中的进一步应用提供了条件。

Based on the practice that the chip devices used for aerospace product is inspected by AOI technology in the company, through the development of testing procedures, collect the inspected results, find out the defect mode which were false alarm or fail to alarm. Then analyze the defect modes, put forward the ideas to solve the problem. It provides the basis for the efficient use of AOI equipment in other aerospace enterprises, and provides the conditions for the further application of AOI technology in aerospace products.