金表面污染对热压焊接影响分析研究

Pollution effect on the gold surface welding hot analysis research

热压焊接是连接印制电路板的一种新兴微组装技术,在采用热压焊接方式进行的微组装过程中,金表层与金线的可靠键合是关键的质量控制点。本文解析了表贴连接盘金表面清洁度要求,提出了表面污染分析方法,引入了等离子和超声波方法对金表面进行清洗。并通过热压焊后金线拉脱试,验证了等离子清洗和超声波清洗方法的有效性。

Welding is connected with PCB new micro assembly technology. Micro assembly process is carried out in the use of hot welding methods. Reliable key gold surface and gold alloy are the key points of quality control. This paper analyzes the surface degree requires for the connection of gold plate surface cleaning and the method for surface contamination, introduced the plasma and ultrasonic method for cleaning on the gold surface. Through the gold pulling test, it verifies the effectiveness of plasma cleaning and ultrasonic cleaning method.