摘要
研究了抗氧化剂对无氰镀金工艺的影响。通过镀液分散能力、覆盖能力、稳定性、阴极电流效率;镀层结合力、耐蚀性、焊接性能等性能测试表明抗氧化剂在无氰镀金工艺中的重要性。实验证明加入抗氧化剂可以使得电镀金晶粒细小,光泽度好。
In this paper, we study the antioxidant effects on non-cyanide plating process by analysis of solution dispersion ability, capacity, stability, the cathode current efficiency. Coating binding force, corrosion resistance, weldability performance test shows that the importance of antioxidants in non-cyanide plating process. The experiment proves that adding antioxidants can make electric gold-plated has tiny grains and good gloss.
出处
《印制电路信息》
2015年第12期62-65,共4页
Printed Circuit Information
关键词
无氰镀金
抗氧化剂
Non-Cyanide Plating Gold
Antioxidants
