半导体制冷器工艺设计对制冷性能的影响

Influence of Refrigerating Performance by Process Design of Semiconductor Refrigerating Machinery

为了分析半导体制冷器工艺设计方法与制冷效率的关系,探讨其工作寿命的影响因素,文章通过改进半导体制冷器基板材料,采用新型胶黏剂,并通过实验来对比分析半导体电偶间不同的铜片排布方式对制冷器制冷性能、寿命的影响。实验结果表明,连接铜片排布回路形式对制冷性能影响不大,但对产品的使用寿命有一定的影响。铜线排列走向简单,电阻变化率低,使用寿命相对较长。

In order to analyze technological design of semiconductor refrigerating machinery and refrigeration efficiency,explore the influence factors of its working life,this paper adopted a new type rubber adhesion agent by improving the substrate material of semiconductor refrigerating machinery,and through the experiment to analyze different methods of copper arrangement between semiconductor galvanic cooler cooling performance and characteristic parameters at two aspects of life.The experimental results show that the connection of copper has little influence on the cooling performance of configuration circuit,but has certain influence on the products service life,copper wire arrangement simple,due to its low resistance rate,its service life is relatively long.