线路板用导热绝缘涂料的研究

Study of Thermal Conductive Insulating Coating for Circuit Board

采用环氧树脂体系为基础,加入球形氧化铝及其他助剂制备了热固性绝缘导热涂料。通过对涂料的黏度、导热系数、红外光谱、TGA等进行测试,比较分析了涂料固化前后的性能,最终确定了涂料配方。结果表明:该涂料的储存时间超过24 h,经60℃/24 h固化后导热率为1.1 W/(m·K),击穿强度不低于35 MV/m,其他性能均符合常规线路板的生产要求。

Using epoxy resin as matrix, and adding spherical alumina and other additives, we prepared a thermoset thermal conductive insulating coating. Through testing its viscosity, thermal conductivity, infrared spectrum, and TGA, the various properties of the coating before and after curing were analyzed, and finally the formula of coating was determined. The results show that the storage time of the coating is more than 24 h. After the coating is cured at 60 ℃ for 24 h, its thermal conductivity is 1.1 W/（m·K）, the breakdown strength is no less than 3.5 kV/mm, and the other properties can achieve the requirements of conventional circuit board.