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环氧树脂和酚醛树脂对塑封料性能影响的研究 被引量:3

The Study of Effects on the Epoxy Molding Compound of the Epoxy Resin and Phenolic Resin
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摘要 研究了环氧树脂和酚醛树脂对环氧模塑料的性能的影响:环氧树脂对Tg(玻璃化转变温度)的影响顺序为:DCPD型<MAR型<普通的邻甲酚醛型;酚醛树脂对Tg的影响顺序为MAR型<XYLOK型<普通邻甲酚醛型。环氧树脂对冲击强度的影响顺序:DCPD型>MAR型>普通邻甲酚醛型;酚醛树脂对冲击强度的影响顺序为:MAR型>XYLOK型>普通邻甲酚醛型。当环氧树脂为DCPD型,酚醛树脂为MAR型时,得到的Tg最低,冲击强度最高。 This paper study the effects on the epoxy molding compound of epoxy resin and phenolic resin, the results show that influence of epoxy resin type on Tg is DCPD type 〈 MAR type 〈 normal EOCN type; influence of phenol type on Tg is MAR type 〈 XYLOK type 〈 normal PN type. Influence of epoxy resin type on impact strength is DCPD type 〉 MAR type 〉 normal EOCN type; and influence of phenol resin type on impact strength is MAR type 〉 XYLOK type 〉 normal PN type. DCPD type epoxy resin and MAR type phenol resin show lowest Tg and highest impact strength.
出处 《电子工业专用设备》 2015年第11期11-15,共5页 Equipment for Electronic Products Manufacturing
关键词 环氧塑封料 冲击强度 树脂 Epoxy molding compound impact strength Resin
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