摘要
根据爱克发公司近三年的专利,评述了该公司近期热敏CTP版材研制开发的内容:①传统热敏版②免处理非热烧蚀型热敏版;③热烧蚀型免处理版材。免处理版材被认为是热敏版材今后研究开发的方向。
Progress of thermal sensitive CTP plates was reviewed according to the patents of Agfa in recent three years.The plates that Agfa has researched and developed recently include:1traditional thermal sensitive plates;2processless non ablatable thermal sensitive plates;3thermal ablatable processless plates.Processless plates are considered as the direction of research and development in future.
出处
《信息记录材料》
2002年第1期42-44,49,共4页
Information Recording Materials
