半导体工业用镍铂合金靶材的制备及结构研究

Preparation and Structure of NiPt Alloy Target Used in Semiconductor Industry

采用熔炼、均匀化退火处理及温轧技术制备出NiPt合金靶材。采用金相、扫描电镜(SEM)、X射线衍射(XRD)等手段对NiPt合金在制备过程中的结构变化进行了研究。同时也研究了靶材结构与靶材溅射后表面形貌之间的关联性。研究表明,均匀化处理对NiPt合金获得择优取向具有明显影响,合金经过铸造、均匀化、轧制等工艺,其硬度分别为292、218、439,可分别形成(200)织构、(311)织构、(200)+(220)织构。靶材微观结构与溅射后表面形貌均匀性具有关联性。

NiPt alloy target was produced by melting, homogenization annealing, and warm-rolling. The structural variation of Ni Pt alloy during preparation was observed by using metallography, scanning electron microscopy（SEM）, X-ray diffraction（XRD）, etc. And the relationship between the structure and surface morphologies of the target after sputtering was also investigated. The results show homogenization annealing treatment has obvious effect on the texture. The Vickers-hardness of the alloy after melting, homogenization annealing, and rolling was 292, 218, and 439, and the corresponding texture was（200）,（311）, and mixed（200） and（220）, respectively. The microstructure of the target has relevance to the surface morphologies after sputtering.