真空热压烧结法制备金刚石/Al-Cu基复合材料

Fabrication of Diamond Reinforced Al-Matrix Composites by Vacuum Hot Press Method and Thermal Properties

采用真空热压烧结法成功制备了金刚石/Al-Cu基复合材料。研究表明,少量Cu粉的添加,能优化金刚石/纯Al复合材料的热膨胀系数、热导率等热性能。在室温~300℃,金刚石体积含量为50%的复合材料热膨胀系数为（7.3~11.3）×10-6/℃。在室温下,热导率为325 W/（m·K）。

Diamond/Al-Cu matrix composites were fabricated successfully by a vacuum hot press method.The thermal expansion coefficient（CTE）and thermal conductivity（TC）of diamond/pure Al composites can be optimized with adding a small amount of Cu powders.The results show that the CTE of diamond/Al-Cu matrix composites with 50% diamond content reaches（7.3~11.3）×10-6/℃ between room temperature to 300 ℃ and the TC is 325 W/（m·K）at room temperature.