振动镀在陶瓷二次金属化中的应用

Application of vibratory electroplating to secondary metallization of ceramic

采用振动电镀的方法在经过金属化的陶瓷表面镀镍(即二次金属化)。利用扫描电镜(SEM)、激光共聚焦扫描显微镜(LSCM)和X荧光测厚仪(XRF)考察了振动频率、电压以及电流对镍镀层形貌、表面粗糙度以及沉积速率的影响。结果表明,振动镀所得镍镀层表面致密,电流和电压对镀层粗糙度的影响较小,振动频率为17.4 Hz时镀层表面粗糙度最小。随着电流或电压的增加,镍的沉积速率加快。振动镀所得镍镀层的结合力满足陶瓷二次金属化后烧结的要求,焊料在其表面的浸润性也良好。

The vibratory electroplating of nickel was carried out on metallized ceramic for its secondary metallization. The effects of frequency, voltage, and current on micro-morphology, surface roughness, and deposition rate of nickel coating were studied by scanning electron microscope（SEM）, laser scanning confocal microscope（LSCM）, and X-ray fluorescence（XRF） thickness tester. The results showed that the vibratorily electroplated nickel coating has a compact surface, and the electroplating voltage and current slightly affect its surface roughness. The nickel coating obtained at a vibratory frequency of 17.4 Hz has the minimum surface roughness. The higher the voltage or current is, the faster the deposition of nickel. The nickel coating obtained by vibratory electroplating has satisfactory adhesion strength for sintering after secondary metallization of ceramic, as well as good wettability to solder.