芯片偏置对散热器倾斜程度影响分析

Effect Analysis of Chip Offset on Heat Sink Tilt Degree

采用有限元分析方法,仿真分析多种芯片偏心位置及散热器倾斜状况,比较散热器倾斜程度,优化芯片最佳的偏置位置,为芯片摆放提供最优建议。通过不同芯片位置对散热器倾斜程度影响的分析,得出以下结论:芯片向正上方偏移时,散热器的倾斜程度与芯片偏置距离呈线性关系。故芯片偏置距离越小,散热器的倾斜程度越小;向上偏置一定距离后,还需再向左或向右偏置的话,都会增加散热器的倾斜程度;芯片斜置时,平衡芯片几何中心至2个固定孔的距离,使芯片至2个固定孔距离差最小,可使散热器倾斜程度最小。

By applying finite element analysis method, the effect of chip offset on heat sink tilt phenomenon is analyzed. The best offset location of chip was identified and some suggestions for chips were provided. According to the results, the following conclusions were drawn, when the chip offset is located directly above, the relationship be- tween tilt of heat sink and chip offset distance is linear. Thus, as the chip offset distance decreases, the tilt degree decreases. If the offset is moved up- ward a certain distance and if its direction is re- quired to be towards the left or towards the right, tilt of heat sink will increase. When the chip off- sets obliquely, minimizing the distance between chip and two fixed holes, the tilt degree of the heat sink tilt can be minimized.