摘要
分别使用62Sn36Pb2Ag焊料和63Sn37Pb共晶焊料焊接模拟式太阳敏感器硅光电池电极,通过力学试验和加速热循环试验,对比分析了两种焊料形成的焊点性能和显微组织结构。研究表明,由于Ag元素的加入,与63Sn37Pb焊料相比,62Sn36Pb2Ag焊料焊点显微组织内部颗粒状的Ag3Sn有效起到了位错钉扎的作用,在强化焊点的同时,也提高了焊点抗热失配能力和抗蠕变性能。在经历力学试验和-105^+105℃循环试验后,62Sn36Pb2Ag焊点裂纹扩展率远低于63Sn37Pb焊点。在给定的试验条件和温度循环范围内,62Sn36Pb2Ag焊料的抗热失配能力和高温抗蠕变性能较63Sn37Pb焊料表现更加优异。
The performance and the microstructure analysis were carried out on 62Sn36Pb2Ag solder and 63Sn37Pb solder used in silicon battery of analog sun sensor by mechanical test and accelerated thermal cycle test. Results show that the granulated Ag3 Sn plays the role of dislocation pining effectively in 62Sn36Pb2Ag solder because of the addition of Ag element. In strengthening the joints, the granulated Ag3 Sn also improves the resistance to the thermal mismatch and the creep of the solder. After experiencing mechanical test and the temperature cycle test from -105 to ＋105℃, the crack growth rate of 62Sn36Pb2Ag joint is much less than the 63Sn37Pb joint. Under the cer- tain test condition in the article, the resistance to the thermal mismatch and the creep of 62Sn36Pb2Ag is better than 63Sn37Pb solder.
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2015年第2期73-76,共4页
Aerospace Materials & Technology
