TSV三维集成的缺陷检测技术

Defect Inspection Technologies for TSV Based 3D Integration

硅通孔(TSV)三维集成以其集成密度大、互连延时短以及潜在经济效益高等优势迅速成为了研究热点,三维集成的缺陷检测技术对于优化制造工艺、降低生产成本以及提高器件可靠性等方面均具有十分重要的意义。总结了TSV三维集成缺陷检测面临的巨大挑战,详细介绍了四类缺陷检测方法,包括电学检测方法、光学检测方法、声学检测方法以及X射线检测方法,讨论了这些方法应用于三维集成缺陷检测的原理、特性、不足以及需要解决的关键问题。未来三维集成缺陷将愈加复杂,需要不断加强缺陷的生成和演变机理研究,丰富缺陷检测方法,并持续改善各类方法的检测精度、稳定性以及检测效率。

TSV based 3D integration has become a hot research topic rapidly with the advantages of its high integration density,short latency time and enormous potential economic benefits. The corresponding defect inspection technologies bring outstanding benefits for improving manufacturing processes,reducing production cost and enhancing device reliabilities. The defect detection challenges of TSV based3 D integration were concluded,and the four defect inspection methods including electrical inspection method,optical inspection method,acoustic inspection method and X-ray inspection method were introduced. For each method,the principles,distinctive characters,deficiencies together with critical concerns to be resolved were respectively demonstrated in detail. As defects of future 3D integration will be more complicated,researches about origin and transformation mechanisms of defects should be performed so as to raise more diagnose methods. The precision,stability and efficiency of the methods also need to be constantly improved.