冷压烧结-热挤压复合工艺制备亚微米SiC_P/Cu复合材料的力学及耐磨性能

Mechanical and Wear Resistance Properties of Submicro-meter SiC_P/Cu Composite Prepared by Cold Press Sintering-Hot Extrusion Composite Technology

采用冷压烧结-热挤压复合加工工艺制备了亚微米SiC颗粒增强铜基复合材料,研究了SiCP/Cu复合材料的微观组织、显微硬度、力学性能、导电性能和耐磨性能。结果表明采用本方法可以获得组织致密的亚微米SiC颗粒增强Cu基复合材料。复合材料5vol%亚微米SiCP/Cu复合材料展现出了优良的耐磨性能,是锡青铜的1.7~8倍。在复合材料磨损表面形成了高硬、SiC颗粒弥散均匀的耐磨损层。

The microstructure, microhardness, mechanical properties, electric conductivity and wear resistance of SiCp/Cu composite prepared by cold press sintering-hot extrusion composite technology were studied. The results show that sub micron-meter SiC particle reinforced Cu matrix composite can be obtained by above methods. 5vo1% SiCv/Cu composite shows good wear performance, which is 1.7-8 times higher than that of tin bronze. A kind of wearing layer with high hardness and SiC dispersion distribution forms on the composite surface