电子封装结构无铅焊点可靠性有限元模拟的研究进展

Development of lead-free solder joints reliability in electronic packaging based on finite element simulation

有限元方法可以简化电子封装无铅焊点可靠性研究的程序,符合电子产品快速制造技术的发展趋势。国内外学者采取有限元方法模拟无铅焊点在服役期间的应力-应变响应,取得了丰硕的研究成果。综合评述了电子产品在热循环、跌落、湿气以及电迁移条件下焊点可靠性的有限元模拟成果,探讨国内外在该领域的研究现状。分析在无铅焊点可靠性有限元模拟研究方面存在的问题及解决方法,展望无铅焊点可靠性的未来发展。为电子封装结构无铅焊点可靠性的进一步研究提供基础支撑。

Finite element methods can simplify the research procedure of lead-free solder joints reliability in electronic packaging, and meet the development trend of rapid prototypiug technology in electronic industry.Researchers at home and abroad have done lots of work on stress-strain response of lead-free solder joints in service based on finite element simulation.In this paper,the literature of solder joints reliability including during thermal cyclic loading, drop testing, moisture atmosphere and eletromigration are reviewed to analyze the research trend of this field.Moreover,the problems in the process of the finite element simulation of lead-free solders solder joints are analyzed,some suggestions are put forward which may solve those issues as mentioned above,and the future development of lead-free solder reliability is prospected,which provides the base support for the further study on the lead-free solder joints reliability in electronic packaging.