电子装联中透锡率提高途径探索

Exploration on the Ways of Improving Penetration Rate of Tin in Electronic Assemblies

印制电路板金属化孔透锡率是衡量电子产品印制电路板焊接质量的一项重要指标。文章将从影响通孔插装元件金属化孔透锡率的因素着手,找到提高电子装联中通孔插装元件金属化孔透锡率的方法。

Penetration rate of tin of plated hough hole of PCB is an important indicator of circuit board welding quality.This article will analyze the factor of the penetration rate of tin,to find the method of improving the penetration rate of tin in electronic assemblies.