纳米材料微阵列超塑微成形机理与尺度效应

Superplastic Micro-forming Mechanism and Size Effects of Micro-array Made of Nanocrystalline Material

微成形技术是未来批量制造高精密微小零件的关键技术,但是,微小尺度下材料的塑性变形行为不仅表现出明显的尺度效应,而且零件尺度已经接近常规材料的晶粒尺寸,每个晶粒的形状、取向、变形特征对整体变形产生复杂的影响,难以保证微成形的工艺稳定性。本项目采用纳米材料进行微成形,制造微阵列,零件内部包含大量的晶粒,可以排除晶粒复杂性的影响,而且纳米材料具有超塑性,在超塑状态下,变形抗力和摩擦力都明显降低,从而显著降低微成形工艺对模具性能的苛刻要求,提高工艺稳定性和成形精度。目前,纳米材料超塑性微成形技术方面的研究极少,变形时纳米材料的力学行为、变形机理、尺度效应、位错演化、力学模型等关键问题还有待研究。采用电沉积技术制备晶粒尺寸可控的纳米材料,将工艺实验研究、性能测试、组织分析、力学性能表征、数值模拟相结合,深入探究了纳米材料微阵列超塑性微成形机理和成形规律,以促进该技术的广泛应用。

Micro-forming is a key technique for fabricating high-precision micro-part in large volume. However,plastic deformation at small scale has obvious size effects. The shape,orientation and deformation behavior of each grain have complicated influence on the micro-forming,since the scale of the parts approaches to the size of grain in common materials. Consequently,it is very hard to ensure the processing stability of micro-forming. In the current project,nanocrystalline materials were used to form micro-array. The influence of grain complexity could be eliminated since there were a lot of grains in the micro-part. In addition,nanocrystalline materials usually have superplasticity. Under this condition,the deformation force and friction decrease obviously,which decreases the requirement on the mechanical properties of dies,and improves the processing stability and the forming precision. Currently,little work has been reported on the superplastic micro-forming of nanocrystalline materials. Some key scientific issues remain to be resolved,such as the deformation behav-iors,deformation mechanism,scale effect,dislocation evolution and mechanical model of nanocrystalline materials during deformation. Electrodeposition technique was used to fabricate the nanocrystalline materials with controllable grain size. In order to realize the wide application of this technique,the superplastic micro-forming mechanism and rule of micro-array made of nanocrystalline material were investigated in depth through the combined methods of processing experiments,property measurement,microstructure analysis,characterization of mechanical property,and numerical simulation.