摘要
为实现Al2O3陶瓷与5005铝合金的低温连接,采用Ag-Cu-Ti粉末对Al2O3陶瓷表面进行活性金属化处理.结果表明,当活性金属化温度为880~900℃,保温时间10 min时,在Al2O3陶瓷界面形成连续致密无缺陷的Ti3Cu3O反应层.采用Al-Si钎料对活性金属化Al2O3陶瓷与5005铝合金进行高频感应钎焊,研究了接头的典型界面组织及其形成过程.结果表明,当温度为600℃,保温时间为1 min时,铝合金侧由团状α-Al和晶间渗入的AlAg-Cu共晶组织构成,团状α-Al上有板条状初晶硅出现,Al2O3陶瓷侧有弥散分布的过共晶Al-Si组织,Ti3Cu3O反应层的形成是实现Al2O3陶瓷与5005铝合金可靠连接的关键,接头的最大抗剪强度达到52 MPa.
In order to achieve the complete joint of Al2O3 ceramics /5005 aluminum alloy at the low temperature,the Al2O3 ceramic were metallized with the Ag-Cu-Ti powder. It was shown that a continuous Ti3Cu3 O reaction layer adjacented to the Al2O3 ceramic was confirmed. The interfacial structures and formation of the active metallized Al2O3/ Al-Si / 5005 aluminum alloys ceramic high-frequency induction brazed joints were analyzed. It was shown that the microstructure of the 5005 aluminum alloys /Al-Si / Al2O3 ceramic joint brazed at 600 ℃ for 1 min was： 5005aluminum alloys / α-Al ＋ Al-Ag-Cu eutectic ＋ Si crystal / AlS i alloy ＋ α-Al ＋ ξ-Ag2 Al / Ti3Cu3 O / Al2O3 ceramic. The maximum shear strength was 52 MPa.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2015年第6期35-38,114-115,共4页
Transactions of The China Welding Institution
基金
国家自然科学基金资助项目(51174066)
