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含氟有机硅改性环氧树脂复合材料的制备与性能 被引量:5

Preparation and Properties of Fluorinated Silicone Modified Epoxy Resin Composite
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摘要 以二苯基硅二醇、甲苯二异氰酸酯和八氟戊醇为主要原料合成了一种含氟有机硅改性剂(FSM),将其与环氧树脂及固化剂混合制备环氧复合材料,这种材料具有机硅和有机氟的特性。通过热失重分析、接触角分析、表面元素分析、冲击强度分析,得出该复合材料中当含氟有机硅改性剂的含量达到20 phr时,最大热失重速率温度达到375℃,接触角达到120.8°;当含氟有机硅改性剂的含量达到15 phr时,冲击强度相比于纯环氧树脂上升了83%。同时该改性剂的分子结构中含有能与环氧树脂固化的活性基团,在与异佛尔酮二胺的复配使用中,既起到了改性剂的作用,又起到了固化剂的作用。 A fluorinated silicone modified agent was prepared via polymerization of diphenyl silicone glycol,toluene diisocyanate and octafluoro pentanol,and then was mixed with epoxy resin and curing agent,after that got epoxy composites. This material has characteristics of organic silicon and organic fluorine. The thermal gravimetric analysis,contact angle analysis,surface elemental analysis and impact strength analysis were used to study epoxy composites. It comes to the conclusion that when the content of fluorine containing silicone modified agent reaches 20 phr,the maximum heat loss rate temperature reaches 375 ℃ and the contact angle is 120. 8°. And the impact strength increases by 83% compared to the pure epoxy resin when the content of fluorine containing silicone modified agent reaches 15 phr. The molecular structure of the modifier contains the active groups which can cure epoxy resin,so it has effects of modifier and curing agent.
出处 《高分子材料科学与工程》 EI CAS CSCD 北大核心 2015年第12期120-125,共6页 Polymer Materials Science & Engineering
基金 吉林省科技厅科技发展计划资助项目(20120319)
关键词 环氧树脂 含氟有机硅 热稳定性 疏水性 epoxy resin fluorinated silicone thermal stability properties hydrophobic properties
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参考文献13

  • 1韦春,谭松庭,王霞瑜.反应型液晶聚合物改性环氧树脂性能的研究[J].高分子材料科学与工程,2003,19(1):168-171. 被引量:32
  • 2Gupta V B, Drzal L T, Lee C Y , et al. The tempermurt dependence of some mechanical properties of a cured epoxy rcsm system[J]. Polym. Eng. Sci., 2004, 25: 812-823.
  • 3De'Nve B, Shanahan M E R. Water absorption by an epoxy resin and its effect on the mechanical properties and infra-red spectrai . Polymer, 1993, 34: 5099-5105.
  • 4Thomas R, Ding Y, He Y, et al. Miscibility, morphology, thermal, and mechanical properties of a DGEfSA based epoxy resm toughened with a liquid rubber[j ]. Polymer, 2008, 49:278 294.
  • 5Park S j, Jin F L, Lee J R. Thermal and mechanical propertics of tetrafunctional epoxy resin toughened with epoxidized soybean oil[ J ]. Mater. Sci. Eng., A, 2004, 374: 109-114.
  • 6Tuncer E, Sauers I, James D R, et al. Electrical properties of epoxy resin based nano-composites[J ]. Nanotecbnology, 2007, 18: 284- 287.
  • 7Chekanov Y, Ohnogi R, Asai S, et al. Electrical properlics oi cpoxy resin filled with carbon fibers[J]. J. Mater. Sci., 1999, 34:5589-5592.
  • 8Bellucci S, Coderoni L, Micciulla F, et al. The electrical properties of epoxy resin composites filled with CNTs and carbon black. [J ].J.Nanosci. Nanotechnol, , 2011, 11: 9110-9117(8).
  • 9Kasemura T, Oshibe Y, Uozumi H, et al. Surface modification of epoxy resin with fluorine-containing methacrylic ester eopolymers[J ]. J. Appl. Polym. Sci., 2003, 47: 2207-2216.
  • 10苏倩倩,刘伟区,侯孟华.有机硅改性提高环氧树脂韧性和耐热性的研究[J].精细化工,2008,25(1):23-27. 被引量:50

二级参考文献26

  • 1TanST Zhang H L Wang X Y.高分子学报 (Acta Polymerica Sinica),1998,2:167-167.
  • 2Simon S L,Gillham J K.J.Appl.Polym.Sci.,1993,47:461~485.
  • 3Pascault J P,Galy J,Mechin F.in Chemistry and Technology of Cyanate Ester Resins,Edited by Hamerton I,Glasgow:Chapman & Hall,1994,116~121.
  • 4Kasehagen L J,Macosko C W.Polym.Int.,1997,44:237~247.
  • 5Fyfe C A,Niu J,Rettig S J,et al,Macromolecules,1992,25:6289~6301.
  • 6Bartolomeo P,Chailan J F,Vernet J L.Euro.Polym.J.,2001,37(4):659~670.
  • 7李文峰 (LI Wen-feng).西北工业大学学位论文 (Degree Thesis of Northwestern Polytechnical University),2001.
  • 8Grenier-Loustalot M F,Lartigau C,Metras F,et al.J.Polym.Sci.,Part A:Polym.Chem.,1997,35(15):3101~3115.
  • 9Fyfe C A,Niu J,Rettig S J,et al.J.Polym.Sci.:Part A:Polym.Chem.,1994,32:2203~2221.
  • 10刘毅峰(LIUYi-feng) 张娟(ZHANGJuan) 李华(LIHua).化学通报,2002,(3):167-173.

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