一种透明环氧改性有机硅树脂的制备与性能

Preparation and Performances of a Kind of Transparent Epoxy-Modified Silicone Resins

采用二甲基二乙氧基硅烷与γ-(2,3-环氧丙氧)丙基三甲氧基硅烷为原料,经溶胶凝胶法,制备了透明的环氧改性有机硅树脂预聚物。将所得环氧改性有机硅树脂预聚物在4-甲基六氢苯酐为固化剂,二甲基苄胺为促进剂,经80℃固化1 h,120℃固化1 h,150℃固化2 h后,获得透明的环氧改性有机硅树脂固化物。研究了固化物的性能,结果表明,随着R/Si值增大,所得透明环氧树脂的透光率逐渐升高,但其硬度、玻璃化转变温度和热分解温度都逐渐降低。总体而言,当环氧改性有机硅树脂R/Si=1.6时,固化物具有很高的透光率,较好的热稳定性,可调的硬度,对基材有良好的粘接力,这表明所得环氧改性有机硅树脂有望用于光学透明器件的封装。

Transparent epoxy-modified silicone resins were produced through sol-gel method with γ-（ 2,3-epoxypropoxy） propytrimethoxysilane and dimethyldiethoxylsilane catalyzed by HCl. Subsequently,the epoxy-modified silicone resins obtained were cured with hexahydro-4-methylphthalic anhydride accelerated by N-benzyldimethylamine. The performances of the cured epoxy-modified silicone resin were investigated and discussed in detail. As to the cured epoxymodified silicone resins obtained,the transparency increases while the hardness,glass transition temperature and thermal decomposition temperature decrease with the increment of R / Si value in the range of 1. 4 and 1. 7. Generally speaking,the cured epoxy-modified silicone resins with R / Si = 1. 6 expresse fairly high transparency,good thermal stability,adjustable hardness（ 15 - 70 Shore D） and fairly high adhesion-stress,which indicates that the epoxy-modified silicone resins obtained can be good candidate for optical devices package.