期刊文献+

2015年印制电路技术热点 被引量:5

The printed circuit technology hot spots in 2015
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摘要 根据有关文献资料归纳2015年印制电路技术热点。印制电路板技术突出在高频高速化、轻薄小型高密度化、大功率高耐热化和绿色生产低成本化,对这四方面作陈述。 According to the relevant documents, this paper concluded the hot spots of the PCB technology in 2015. PCB technology is outstanding in high frequency, high density, high Heat resistance, green production and low cost. It made a narrative states on these four fields.
作者 龚永林
出处 《印制电路信息》 2016年第1期5-10,共6页 Printed Circuit Information
关键词 印制电路技术 高频 高密度 高耐热 低成本 PCB Technology High Frequency High Density High Heat Resistance Low Cost
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参考文献13

  • 1Kirk Fabbri. Effective Characteristic Impedance[J/ OL]. PCB Design,2015/02.
  • 2John Coonrod. A Brief Overview of High-Frequency Laminates[J/OL]. PCB Design, 2015/08.
  • 3Jeff Loyer. Copper Roughness Electromagnetic 101 [J/OL]. PCDS&F, 2015/11.
  • 4John Coonrod, Impact of Final Plated Finish on PCB Loss[J/OL]. PCB Design, 2015/10.
  • 5Tarja Rapala etc. Next-Generation Ultra-Thin HDI PCB Manufacturing Challenges[J/OL]. PCB magazine, 2015/04.
  • 6Jason Carver etc. A High-Reliability, Stress-free Copper Deposit for FPC, Polyimide and Rigid-Flex [J/OL]. PCB magazine, 2015/06.
  • 7David Ciufo. Coated Ultra-Thin Copper on Printed Circuit Laminates[OL]. pcb007.com, 2015/07/18.
  • 8Shingo Yoshioka etc. Novel High-Performance Substrate for Stretchable Electronics[J/OL]. PCB magazin, 2015/06.
  • 9Happy Holden. A Review of the Opportunities and Processes for Printed Electronics[OL]. pcb007.com 2015/06/22.
  • 10Les Round. Thermal Management for LED Lighting Application[J/OL]. PCB Magazine, 2015/03.

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