填孔电镀漏填原因及流程选择研究

Research on leakage hole root causes and process selection of the via filling planting

文章介绍印制电路板填孔电镀工艺过程中,盲孔漏填,空洞等问题产生的原因,根据可能存在的原因分析给出了改善此类缺陷的方向。

This paper introduces the defects in printed circuit board holes filling in the electroplating process such as blind hole filling leakage, the reasons of the problems such as hollow. According to the analysis of the causes, it give possible direction to improve such defects.