摘要
该文主要针对一款光纤LED驱动芯片在应用中出现的异常问题进行探讨。基于电路成品封装是多芯片封装,封装体内额外增加了一只LED管,造成成品测试和芯片测试在电性能上存在部分差异。文中通过对异常品失效情况汇总及原因分析,探讨芯片测试中存在的问题,依据分析结果提出合理的测试解决方案。
In this paper,an unusual problem for the fiber optic LED driver chips appear in the application were discussed.Based on Circuit finished package is a multi- chip package,package body adds an extra LED tube,resulting in product testing and chip testing there is some difference in the electrical properties.In this paper the causes of abnormal products through failure analysis is summarized and discussed the problems in chip testing,according to results of the analysis put forward reasonable solutions.
出处
《电子质量》
2016年第1期12-16,共5页
Electronics Quality
关键词
封装
性能
失效
测试
package
performance
failure
test
