异步累积叠轧超细孪晶铜织构取向的演变

Texture evolution of ultra-fine twin copper by asymmetrical accumulative rolling bonding

孪晶能够在保持铜材电导率基本不变的情况下提高铜材强度,异步叠轧制备出超细晶铜材,再结晶过程中形成大量超细孪晶,通过背散射电子衍射研究织构演变,异步叠轧变形后原料铜板中的退火孪晶织构组分{114}<221>消失,形成大量剪切织构{001}<110>和铜型织构{112}<111>组分,再结晶退火过程中,逐渐形成新的织构组分:{113}<141>、{125}<112>、{221}<114>,通过矩阵计算得出,其中{221}<114>组分实质上是异步叠轧形成的剪切织构再结晶退火时沿{111}面的镜面反映,而形成的孪晶取向。

Twins can increase the strength of copper,in the case of keeping almost the same electrical conductivity. A large number of ultra-fine twins in ultra-fine grain copper prepared by asymmetrical accumulative rolling bonding（ AARB） were obtained after recrystallization annealing. Evolution of texture was studied by electron back-scattered diffraction（ EBSD） technique. Results show that annealing twin texture { 114} 221 disappears after deformation by AARB,but the shear texture { 001 } 110 and copper-type texture { 112} 111 are obtained. During recrystallization annealing,the new texture component are obtained,including { 113 } 141 ,{ 125} 112 and { 221 } 114 . Through matrix computing,one of the textures { 221 } 114 is twin orientation,a mirror reflection of shear texture from AARB deformation along twinning plane { 111}.